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Palomar Technologies' CBT 6000 high speed, large area, thermosonic
ball bonder redefines traditional measurements of wire bonding
productivity. The true measure of productivity is net throughput.
By utilizing the bonder's large work area, 152mm x 304mm (6"
x 12"), Palomar has designed a series of innovative handling
systems which eliminate indexing time, creating a unique non-stop
bonding platform. The CBT 6000 large platform accommodates parts
of all sizes, allowing for design flexibility.
"The
Palomar CBT 6000 bonder marks a significant milestone in the
MCM-D Consortium Program with the introduction of leading edge
manufacturing technology to electronic packaging" Peter
Ludlow, Director of the MCM D Consortium, sponsored by the Defense
Advanced Research Projects Agency (DARPA), which collaborated
with Palomar in achieving this new technology.
This
ultra fast, accurate bonding technology is ideal for a wide
variety of applications, including large complex hybrids and
multichip modules (MCMs), display panels, automotive assemblies,
disk drive assemblies, flex circuits, chip on board (COB), specialty
leadframes, fine pitch, and IC devices.
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